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Wafer Dicing Machine

Category:Wafer Dicing Machine

The wafer dicing machine is used to cut the wafer and separate each die. Attached with a layer of wafer mount on its back, the wafer then will be sent to the wafer dicing machine through an automatic feeding mechanism. After cut by a high-speed rotating diamond blade, the dies will attache on the wafer mount in good order and then be transported to the cleaning area by a transport arm for centrifugal cleaning. The dies cleaned up by the ionized water (DI pure water) and discharged static electricity will be sent back to the cassette by the transport arm .

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Details

Wafer Dicing Machine

The wafer dicing machine is used to cut the wafer and separate each die. Attached with a layer of wafer mount on its back, the wafer then will be sent to the wafer dicing machine through an automatic feeding mechanism. After cut by a high-speed rotating diamond blade, the dies will attache on the wafer mount in good order and then be transported to the cleaning area by a transport arm for centrifugal cleaning. The dies cleaned up by the ionized water (DI pure water) and discharged static electricity will be sent back to the cassette by the transport arm .

Features

  • High precision, stable and high-speed mechanical structure and transmission parts.
  • Stable performance, elegant appearance, low power, and high-precision work platform.
  • High-precision CCD automatic positioning, automatic correction and recognition.
  • Adapted to 8-inch and 12-inch wafers, ceramic substrates, glass substrates, and Mini LED light panels.
  • The system is simple and easy-to-understand. Real-time monitoring manufacture status, designating production plan and mastering production statics can be realized through the interface.
  • Device parameters

    Item Parameter
    name wafer dicing machine
    model QWD-1202A
    maximum size of workpiece φ300mm
    X axis cutting range 310mm
    Feed speed input range 0.1-1000mm/s
    Y1·Y2 axis cutting range 310mm
    single step 0.001mm
    Y axis positioning accuracy within 0.003mm;
    single deviation within 0.002 mm
    Z1·Z2 axis effective stroke 14.7mm(with φ2 blade)
    movement resolution 0.00005mm
    repeat accuracy 0.001mm
    maximum blade diameter φ58mm(When using φ2" cutting knife)
    Θ axis maximum rotation angle 270°
    spindle rated power 1.2at 600000min-1KW
    Rated torque 0.19N·m
    rotation range 6000-60000
    maximum frame siza 8-12 nches
    other specifications power three-phase AC380
    equipment size 1850*1520*1850mm(L*W*H)
    equipment weight about 2500KG

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